Awang Azman, D. I. N., Narayanan, P. ., Y. Kozutsumi, & Osman, S. A. (2024). Microstructural Evolution of Intermetallic Compound Between SN100C Solder and ENIMAG Substrate During Isothermal Ageing. International Journal of Integrated Engineering, 16(6), 80-89. https://penerbit.uthm.edu.my/ojs/index.php/ijie/article/view/17402