MOM, Sokvisal; HOEUN, Sela; BERNARD, Fabrice; KAMALI-BERNARD, Siham; HAN, Virak. The Effect of Thermal Contact Conductance (TCC) Between Aggregate Inclusion and Matrix on Thermal Conductivity of Cement-Based Material. International Journal of Integrated Engineering, [S. l.], v. 14, n. 5, p. 99–106, 2022. Disponível em: https://penerbit.uthm.edu.my/ojs/index.php/ijie/article/view/11401.. Acesso em: 3 jul. 2024.