AWANG AZMAN, Dayang Izzah Nabilah; NARAYANAN, Pavithiran; Y. KOZUTSUMI; OSMAN, Saliza Azlina. Microstructural Evolution of Intermetallic Compound Between SN100C Solder and ENIMAG Substrate During Isothermal Ageing. International Journal of Integrated Engineering, [S. l.], v. 16, n. 6, p. 80–89, 2024. Disponível em: https://penerbit.uthm.edu.my/ojs/index.php/ijie/article/view/17402. Acesso em: 8 apr. 2026.