Awang Azman, D.I.N. (2024) “Microstructural Evolution of Intermetallic Compound Between SN100C Solder and ENIMAG Substrate During Isothermal Ageing”, International Journal of Integrated Engineering, 16(6), pp. 80–89. Available at: https://penerbit.uthm.edu.my/ojs/index.php/ijie/article/view/17402 (Accessed: 8 April 2026).