D. I. N. Awang Azman, P. . Narayanan, Y. Kozutsumi, and S. A. Osman, “Microstructural Evolution of Intermetallic Compound Between SN100C Solder and ENIMAG Substrate During Isothermal Ageing”, IJIE, vol. 16, no. 6, pp. 80–89, Oct. 2024, Accessed: Apr. 08, 2026. [Online]. Available: https://penerbit.uthm.edu.my/ojs/index.php/ijie/article/view/17402