Cu and CuO Nanoparticles in Heat Transfer Applications: A Comprehensive Review

Abstract

This review highlights the role of Copper (Cu) and Copper Oxide (CuO) nanoparticles in enhancing heat transfer through mono, binary, and ternary nanofluids. Mono nanofluids consistently improved thermal conductivity, viscosity, pressure drop, and heat transfer coefficient, with higher gains at higher concentrations. Binary systems showed synergistic effects, with CuO–MWCNT yielding maximum conductivity, CuO–TiO₂ showing Newtonian behavior, and Cu with Al₂O₃ and TiO₂ achieving peak conductivity at a 40:40:20 ratio. Ternary mixtures of Cu, CuO, and Al₂O₃ offered further conductivity enhancement but with larger pressure drops, notably at 60:20:20. Overall, nanoparticle selection, base fluid, and mixing proportion are key to balancing thermal performance with hydrodynamic penalties.